I am cutting a double sided PCB with 1.4mil copper layers and the circuit is around 20mm x 42mm total and I am using AutoLeveller probing at 4mm spacing, however I am seeing two-three small narrow bands of copper that does not cut deep enough. My circuit uses 0603 imperial SMD. I have attached a picture and the probe file, keep in mind the picture is before I clean up the board.

The problem is when I cut at 0.04mm I get rid of almost all the copper perfectly, but two-three narrow bands that horizontally go across the PCB uniformly. I have had a few that cut well, but most of the boards come out with these bands in the same places, and doing both sides adds to this complexity. The bands look to narrow to be a bow in the board, and they seem to fall between the rows that are being probed. One is around 10mm up Y and the other is 14mm. Unfortunately I have gone deeper down to 0.075mm however in going deep enough to get past these narrow bands I start eating away at the very small traces I need to go between the 0603 components, since it requires two passes between these components to isolate and leave a trace in between the pads.
I have tried everything I can think of, in adding a filter cap to the probe line. I do need to reskim my table as it is slightly higher on one side you will see in the probe file, however this is 90deg opposite of the narrow bands. The biggest thing is under the Microscope the circuit looks perfect everywhere but where these bands are. They look to be to narrow to be a bow in the board, and I would think that when these PCBs are made copper cladding would put a very uniform layer of copper across the board. I think it may be where there is a depression on the board from rollers on a conveyor belt as they are being made, but I would think the copper would still be perfectly uniform depth. They are cheap from Amazon made by uxcel. However I am frustrated running the mill over and over the circuit moving down till I can get rid of these ridges without removing too much from the traces. I have thought about writing a software to lower all points within these ridge areas to compensate. I have also wondered about putting the boards under heat ahead of time to flatten or even them out, however I think the bands are too narrow to be solved by this.
Thanks again for any help, and I would be happy to answer any questions.

Thanks, Andrew.